Bonding Aluminum Wire

วิดีโออื่น ๆ
November 04, 2024
Category Connection: สายเชื่อม
Brief: Discover the Ultrasonic Laser Aluminum Bonding Wire with Composite Material Treatment, designed for high-performance applications in servers and systems. Made from 6N high-purity aluminum with trace elements, this wire is ideal for power semiconductor packaging and various electronic bonding needs.
Related Product Features:
  • Made from 6N high-purity aluminum material with trace elements for superior performance.
  • Widely used in power semiconductor packaging like MOSFET, IGBT, Thyristor, and more.
  • Available in multiple diameters (100μm to 200μm) to suit various applications.
  • Offers excellent breaking load and elongation properties for durability.
  • Suitable for automotive electronics, consumer electronics, and computing equipment.
  • Ideal for chip on board (COB) technology and bonding of discrete components.
  • Comes in lengths of 500, 1000, or 2000 meters for flexible usage.
  • Enhances performance in servers and systems with composite material treatment.
คำถามที่พบบ่อย:
  • What is the Ultrasonic Laser Aluminum Bonding Wire used for?
    It is used for power semiconductor packaging, automotive electronics, consumer electronics, and bonding discrete components like diodes and transistors.
  • What are the available diameters for the aluminum bonding wire?
    The wire is available in diameters ranging from 100μm to 200μm, with specific options like 100±5μm, 125±5μm, 150±5μm, 170±5μm, and 200±7μm.
  • Can I get samples of the aluminum bonding wire?
    Yes, samples are available upon request to help you evaluate the product for your specific needs.
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